Mixed or Complex SMT PCB Assembly combines Surface Mount Technology (SMT) and Through Hole Technology (THT) on a single Printed Circuit Board (PCB). This advanced assembly process is designed for sophisticated electronic products that require both high-density surface-mounted components and mechanically robust through-hole components. Complex SMT assembly is widely used in industries where reliability, performance, and intricate circuit designs are essential. It enables manufacturers to create compact, multifunctional, and high-performance electronic systems. Mixed Technology PCB Assembly involves integrating Surface Mount Devices (SMDs) and Through Hole Components (THCs) onto the same PCB. The assembly process typically includes solder paste printing, automated pick-and-place component placement, reflow soldering, manual or automated through-hole insertion, wave soldering, and comprehensive testing.